SH-QS-BOND

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  • 少量の4-ビニルピリジンを組込んだ中極性ポーラスポリマーPLOTカラム
  • エタン、エチレンおよびアセチレンのベースライン分離が可能
  • 相当品：GS-Q

価格表（島津GLCサイトへ）

P/N ID（内径） df（膜厚） 長さ 温度範囲
227-36366-01 0.53 mm 20 µm 30 m -60 to 250 ℃

SH-QS-BONDカラムのIntegrated Guardカラムページをお求めの場合は、Integrated Guard ページをご参照ください。

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